層號 層數(shù)描述 疊構(gòu)設(shè)計 各層厚度及銅厚(mil) er Layer Solder Mask 0.4 3.5 Layer 1 TOP 1.3 1 Prepreg 8 4.1 Layer 2 GND 0.6 2 Core 3 4.2 Layer 3 PWR 0.6 3 Prepreg 8 4.1 Layer 4 BOT 1.3 4 Solder Mask 0.4 3.5
TOP&BOT 12MIL 50OHM
TOP & BOT 6/4/6MIL 90OHM