高速pcb設(shè)計之布局檢查
1.import idf (emn file)部份:
good no good check item 問題點(diǎn)說明
[ ] [ ] 1.01 確認(rèn)無遺漏相關(guān)零件.
2. keepin / keepout 部份:
good no good check item 問題點(diǎn)說明
[ ] [ ] 2.01 確認(rèn)package keepin.
[ ] [ ] 2.02 確認(rèn)cpu keepout.
[ ] [ ] 2.03 確認(rèn)bga keepout.
[ ] [ ] 2.04 確認(rèn)fan keepout.
good no good check item 問題點(diǎn)說明
[ ] [ ] 2.05 確認(rèn)heat sink keepout.
[ ] [ ] 2.06 確認(rèn)simm / dimm / rimm socket keepout.
[ ] [ ] 2.07 確認(rèn)daughter card keepout.
[ ] [ ] 2.08 確認(rèn)mechanical keepout.
3. component 部份:
good no good check item 問題點(diǎn)說明
[ ] [ ] 3.01 確認(rèn)螺絲孔是否正確.
[ ] [ ] 3.02 確認(rèn)slot 零件座標(biāo)是否正確.
[ ] [ ] 3.03 確認(rèn)i/o port零件座標(biāo)是否正確.
[ ] [ ] 3.04 確認(rèn)socket zif 拉桿是否順暢.
[ ] [ ] 3.05 確認(rèn)dimm socket組件高度是否會卡件.
[ ] [ ] 3.06 確認(rèn)零件擺放是否符合機(jī)構(gòu)設(shè)計.
[ ] [ ] 3.07 確認(rèn)key-components 設(shè)定fixed.
good no good check item 問題點(diǎn)說明
[ ] [ ] 3.08 確認(rèn)critical component擺放位置正確.
[ ] [ ] 3.09 確認(rèn)by-pass capacitor擺放位置正確, chipset 附近每邊至少一個bypass cap.
[ ] [ ] 3.10 確認(rèn)spacing between components恰當(dāng).
[ ] [ ] 3.11 確認(rèn)重量較重之零件是否盡可能已擺放於后制之層面.
(避免第二次過高溫爐掉件問題)
[ ] [ ] 3.12 確認(rèn)un-placed component = 0.
[ ] [ ] 3.13 確認(rèn) components placement drc = 0.